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Global Mixed-mode Technology Inc.
G913
150mA Low-Dropout Linear Regulators
Features
Low, 55A No-Load Supply Current Guaranteed 150mA Output Current Dropout Voltage is 70mV @ 50mA Load Over-Temperature Protection and Short-Circuit Protection Two Modes of Operation ---Fixed Mode: 2.84V (G913A), 3.15V (G913B), 3.30V (G913C), 3.00V (G913D) Adjustable Mode: from 1.25V to 5.5V Max. Supply Current in Shutdown Mode < 1A Low Output Noise at 220VRMS Stability with lost cost ceramic capacitors
General Description
The G913 is a low supply current, low dropout linear regulator that comes in a space saving SOT23-5 package. The supply current at no-load is 55A. In the shutdown mode, the maximum supply current is less than 1A. Operating voltage range of the G913 is from 2.5V to 5.5V. The over-current protection limit is set at 250mA typical and 150mA minimum. An overtemperature protection circuit is built-in in the G913 to prevent thermal overload. These power saving features make the G913 ideal for use in the battery-powered applications such as notebook computers, cellular phones, and PDA's. The G913 has two modes of operation. When the SET pin is connected to ground, its output is a pre-set value: 2.84V for G913A, 3.15V for G913B, and 3.30V for G913C, and 3.00V for G913D. There is no external components needed to decide the output voltage. When an output other than the preset value is needed, two external resistors should be used as a voltage divider. The output voltage is then decided by the resistor ratio. The G913 comes in a space saving SOT23-5 package.
Applications
Notebook Computers Cellular Phones PDAs Digital still Camera and Video Recorders Hand-Held Devices Bar Code Scanners
Ordering Information
PART MARKING VOLTAGE
G913A G913B G913C G913D 3A 3B 3C 3D 2.84 3.15 3.30 3.00
TEMP. RANGE
-40C~ +85C -40C~ +85C -40C~ +85C -40C~ +85C
PINPACKAGE
SOT 23-5 SOT 23-5 SOT 23-5 SOT 23-5
Pin Configuration
IN OUT OUTPUT VOLTAGE
SHDN
1
5
SET BATTERY
C
G913
IN
_ 1F
SHDN GND SET
COUT 1F
GND
2
G913 G963 Fixed mode
4 OUT SOT23-5 BATTERY CIN 1F IN OUT R1 OUTPUT VOLTAGE
IN
3
G913
SHDN GND
SET R2 COUT 1F
Adjustable mode
Ver 0.9 Preliminary Jan 25, 2002
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Global Mixed-mode Technology Inc.
Absolute Maximum Ratings
VIN to GND..........................................-0.3V to +7V Output Short-Circuit Duration..........................Infinite SET to GND.........................................-0.3V to +7V SHDN to GND....................................-0.3V to +7V SHDN to IN.........................................-7V to +0.3V OUT to GND..............................-0.3V to (VIN + 0.3V)
Note (1): See Recommended Minimum Footprint (Figure 3)
G913
Continuous Power Dissipation (TA = +25C) SOT23-5..................................................520 mW Operating Temperature Range............-40C to +85C Junction Temperature..................................+150C (1) JA ...................................................240C/Watt Storage Temperature Range.............-65C to +160C Lead Temperature (soldering, 10sec)..............+300C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Electrical Characteristics
(VIN =+3.6V, V SHDN =VIN, TA =TJ =+25C, unless otherwise noted.) (Note 1) PARAMETER
Input Voltage (Note 2) Output Voltage Accuracy Adjustable Output Voltage Range (Note 3) Maximum Output Current Current Limit (Note 4) Ground Pin Current
SYMBOL
VIN VOUT VOUT ILIM IQ SET = GND
CONDITIONS
Variation from specified VOUT, IOUT=1mA
MIN TYP MAX UNITS
2.5 -2 VSET 150 5.5 2 5.5 250 55 120 145 2 70 230 300 0.1 0.28 0.08 0.4 0.02 0.8 1.0 220 VIN-0.7 0.4 V % V mA mA A
ILOAD = 0mA ILOAD = 50mA
Dropout Voltage (Note 5)
VDROP VLNR VLDR en VIH VIL I SHDN IQSHDN VSET ISET TSHDN TSHDN
Line Regulation Load Regulation Output Voltage Noise (10Hz to 100kHz) SHUTDOWN
SHDN Input Threshold SHDN Input Bias Current
IOUT = 1mA IOUT = 50mA IOUT =150mA SET=GND, VIN=V(STD)+0.1V,to 5.5V IOUT = 1mA SET tied to OUT, VIN=2.5V to 5.5V, IOUT = 1mA IOUT = 0mA to 150mA VIN=4.2V, IOUT=150mA Regulator enabled Regulator shutdown V SHDN = VIN VOUT = 0V VIN = 2.5V to 5.5V, IOUT = 1mA VSET = 1.3V SET tied to OUT SET = GND COUT = 1F
mV
%/V % VRMS
V A A V nA C C
TA = +25C TA = +25C TA = +25C TA = TMIN to TMAX TA = +25C
0.003 0.2
0.1 1
Shutdown Supply Current SET INPUT SET Reference Voltage (Note 3) SET Input Leakage Current (Note 3) THERMAL PROTECTION Thermal Shutdown Temperature Thermal Shutdown Hysteresis
1.225 1.25 1.275 1.25 5 30 150 15
Note 1: Limits is 100% production tested at TA= +25C. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Note 2: Guaranteed by line regulation test. Note 3: Adjustable mode only. Note 4: Not tested. For design purposes, the current limit should be considered 150mA minimum to 420mA maximum. Note 5: The dropout voltage is defined as (VIN-VOUT) when VOUT is 100mV below the value of VOUT for VIN = VOUT +2V, The performance of every G913 part, see "Typical Performance Characteristics".
Ver 0.9 Preliminary Jan 25, 2002
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Global Mixed-mode Technology Inc.
Typical Performance Characteristics
(VIN= +3.6V, CIN=1F, COUT=1F, G913B, TA=25 C, unless otherwise noted.)
G913
Output Voltage vs. Load Current
3.160 3.150 300 250 200 150 100 50 0
0
Ground Current vs. Load Current
3.140 3.130 3.120 3.110 3.100
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
Ground Current (A)
Output Voltage (V)
10
20
30
40
50
60
70
80
90 100 110 120 130 140 150
Load Current (mA)
Load Current (mA)
Output Voltage vs. Load Current
3.50 3.00 130 120 110
Supply Current vs. Input Voltage
Supply Current (A)
Output Voltage (V)
No Load
100 90 80 70 60 50 40 30 20 10 0
2.50 2.00 1.50 1.00 0.50 0.00 0 1 2 3 4 5 6
ILOAD = 50mA
ILOAD = 0A
0
1
2
3
4
5
6
7
Input Voltage (V)
Input Voltage (V)
Dropout Voltage vs. Load Current
300
Output Noise 10HZ to 100KHZ
250
Dropout Voltage (mV)
200
150
100
50
0
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
Load Current (mA)
Ver 0.9 Preliminary Jan 25, 2002
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Global Mixed-mode Technology Inc.
Typical Performance Characteristics
(VIN= +3.6V, CIN=1F, COUT=1F, G913B, TA=25 C, unless otherwise noted.)
G913
Load Transient
Line Transient
Load Transient
Load Transient
Dropout Voltage vs. Load Current by G913
300 TA=25C 250
Dropout Voltage vs. Temperature
400 350
Dropout Voltage (mV)
Dropout Voltage (mV)
200
Top to Bottom G913C G913B G913D
G913C
300 250 200 150 100 50
ILOAD=150mA
150
100 G913A 50
ILOAD=50mA
ILOAD=0mA
0
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120
Load Current (mA)
Junction Temperature TJ ()
Ver 0.9 Preliminary Jan 25, 2002
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Global Mixed-mode Technology Inc.
Typical Performance Characteristics
(VIN= +3.6V, CIN=1F, COUT=1F, G913B, TA=25 C, unless otherwise noted.)
G913
Turn on Response Time
Turn off Response Time
Shutdown Pin Delay
Shutdown Response Time
Shutdown Pin Delay
Shutdown Response Time
Ver 0.9 Preliminary Jan 25, 2002
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Global Mixed-mode Technology Inc.
Typical Performance Characteristics
(VIN= +3.6V, CIN=1F, COUT=1F, G913B, TA=25 C, unless otherwise noted.)
G913
Shutdown Supply Current
1.00
SHDN Input Bias Current vs. Temperature
0.20
Shutdown Supply Current ( A)
0.60 0.40 0.20 0.00 -0.20 -0.40 -0.60 -0.80 -1.00
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120
SHDN Input Bias Current ( A)
0.80
G913C
G913C 0.10
0.00
-0.10
-0.20
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120
Junction Temperature TJ ()
Junction Temperature TJ ()
SET Input Leakage Current vs. Temperature
60 55 1.260 G913C
SET Reference Voltage vs. Temperature
G913C ILOAD=1mA
SET Input Leakage Current (nA)
SET Reference Voltage (V)
50 45 40 35 30 25 20 15 10 5 0 -5 -10
-40
1.255
VIN=5.5V
1.250
1.245
VIN=3.6V
1.240 VIN=2.5V 1.235
1.230
-30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120
Junction Temperature TJ ()
Junction Temperature TJ ()
Output Voltage vs. Temperature
3.340 G913C ILOAD=1mA 100
Ground Current vs. Temperature
3.330
3.320
VIN=5.5V VIN=3.6V
Ground Current ( A)
80
G913C ILOAD=0A
Output Voltage (V)
60
3.310
40
3.300 VIN=3.4V 3.290
20
3.280
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120
0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120
Junction Temperature TJ ()
Junction Temperature TJ ()
Ver 0.9 Preliminary Jan 25, 2002
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Global Mixed-mode Technology Inc.
Pin Description PIN NAME
1 2 3 4 5
SHDN
G913
FUNCTION
GND IN OUT SET
Active-Low Shutdown Input. A logic low reduces the supply current to less than 1A. Connect to IN for normal operation. Ground. This pin also functions as a heatsink. Solder to large pads or the circuit board ground plane to maximize thermal dissipation. Regulator Input. Supply voltage can range from +2.5V to +5.5V. Bypass with 1F to GND Regulator Output. Fixed or adjustable from 1.25V to +5.5V. Sources up to 150mA. Bypass with a 1F, 0.2 typical ESR capacitor to GND. Feedback Input for Setting the Output Voltage. Connect to GND to set the output voltage to the preset 2.84V or 3.15V or 3.30V or 3.00V. Connect to an external resistor divider for adjustable-output operation.
Detailed Description
The block diagram of the G913 is shown in Figure 1. It consists of an error amplifier, 1.25V bandgap reference, PMOS output transistor, internal feedback voltage divider, mode comparator, shutdown logic, over current protection circuit, and over temperature protection circuit. The mode comparator compares the SET pin voltage with an internal 120mV reference. If the SET pin voltage is less than 120mV, the internal feedback voltage divider's central tap is connected to the non-inverting input of the error amplifier. The error amplifier compares non-inverting input with the 1.25V bandgap reference. If the feedback voltage is higher than 1.25V, the error amplifier's output becomes higher so that the PMOS output transistor has a smaller gate-to-source voltage (VGS). This reduces the current carrying capability of the PMOS output transistor, as a result the output voltage decreases until the feedback voltage is equal to 1.25V. Similarly, when the feedback voltage is less than 1.25V, the error amplifier causes the output PMOS to conductor more current to pull the feedback voltage up to 1.25V. Thus, through this feedback
action, the error amplifier, output PMOS, and the voltage divider effectively form a unity-gain amplifier with the feedback voltage force to be the same as the 1.25V bandgap reference. The output voltage, VOUT, is then given by the following equation: VOUT = 1.25 (1 + R1/R2). (1) Alternatively, the relationship between R1 and R2 is given by: R1 = R2 (VOUT /1.25 + 1). (2) For the reasons of reducing power dissipation and loop stability, R2 is chosen to be 100K. For G913A, R1 is 128K, and the pre-set VOUT is 2.84V. For G913B, R1 is 152K, and the pre-set VOUT is 3.15V. For G913C, R1 is 164K, and the pre-set VOUT is 3.30V. For G913D, R1 is 140K, and the pre-set VOUT is 3.00V. When external voltage divider is used, as shown in Figure 2, the SET pin voltage will be larger than 600mV. The non-inverting input of the amplifier will be connected to the external voltage divider. However, the operation of the feedback loop is the same, so that the conditions of Equations 1 and 2 are still true. The output voltage is still given by Equation 1.
IN SHDN
SHUTDOWN LOGIC ERROR AMP OVER CURRENT PROTECT & DYNAMIC FEEDBACK
P OUT SET
OVER TEMP. PROTECT 1.25V Vref
R1
120mV R2
GND
MODE COMPARATOR
Figure 1. Functional Diagram
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Global Mixed-mode Technology Inc.
IN BATTERY CIN 1F OUT R1 OUTPUT VOLTAGE
G913
G913
SHDN GND
SET R2 COUT 1F RL
Where (TJ-TA) is the temperature difference the G913 die and the ambient air,JA, is the thermal resistance of the chosen package to the ambient air. For surface mount device, heat sinking is accomplished by using the heat spreading capabilities of the PC board and its copper traces. In the case of a SOT23-5 package, the thermal resistance is typically 240oC/Watt. (See Recommended Minimum Footprint) [Figure 3] Refer to Figure 4 is the G913 valid operating region (Safe Operating Area) & refer to Figure 5 is maximum power dissipation of SOT 23-5. The die attachment area of the G913's lead frame is connected to pin 2, which is the GND pin. Therefore, the GND pin of G913 can carry away the heat of the G913 die very effectively. To improve the power dissipation, connect the GND pin to ground using a large ground plane near the GND pin.
Figure 2. Adjustable Output Using External Feedback Resistors Over Current Protection The G913 use a current mirror to monitor the output current. A small portion of the PMOS output transistor's current is mirrored onto a resistor such that the voltage across this resistor is proportional to the output current. This voltage is compared against the 1.25V reference. Once the output current exceeds the limit, the PMOS output transistor is turned off. Once the output transistor is turned off, the current monitoring voltage decreases to zero, and the output PMOS is turned on again. If the over current condition persist, the over current protection circuit will be triggered again. Thus, when the output is shorted to ground, the output current will be alternating between 0 and the over current limit. The typical over current limit of the G913 is set to 250mA. Note that the input bypass capacitor of 1F must be used in this case to filter out the input voltage spike caused by the surge current due to the inductive effect of the package pin and the printed circuit board's routing wire. Otherwise, the actual voltage at the IN pin may exceed the absolute maximum rating. Over Temperature Protection To prevent abnormal temperature from occurring, the G913 has a built-in temperature monitoring circuit. When it detects the temperature is above 150oC, the output transistor is turned off. When the IC is cooled down to below 135oC, the output is turned on again. In this way, the G913 will be protected against abnormal junction temperature during operation. Shutdown Mode When the SHDN pin is connected a logic low voltage, the G913 enters shutdown mode. All the analog circuits are turned off completely, which reduces the current consumption to only the leakage current. The output is disconnected from the input. When the output has no load at all, the output voltage will be discharged to ground through the internal resistor voltage divider. Operating Region and Power Dissipation Since the G913 is a linear regulator, its power dissipation is always given by P = IOUT (VIN - VOUT). The maximum power dissipation is given by: PD(MAX) = (TJ-TA)/JA,=150oC-25oC/240oC/W= 520mW
Ver 0.9 Preliminary Jan 25, 2002
Applications Information
Capacitor Selection and Regulator Stability Normally, use a 1F capacitor on the input and a 1F capacitor on the output of the G913. Larger input capacitor values and lower ESR provide better supply-noise rejection and transient response. A higher- value input capacitor (10F) may be necessary if large, fast transients are anticipated and the device is located several inches from the power source. Power-Supply Rejection and Operation from Sources Other than Batteries The G913 is designed to deliver low dropout voltages and low quiescent currents in battery powered systems. Power-supply rejection is 42dB at low frequencies. As the frequency increases above 20kHz, the output capacitor is the major contributor to the rejection of power-supply noise. When operating from sources other than batteries, improve supply-noise rejection and transient response by increasing the values of the input and output capacitors, and using passive filtering techniques. Load Transient Considerations The G913 load-transient response graphs show two components of the output response: a DC shift of the output voltage due to the different load currents, and the transient response. Typical overshoot for step changes in the load current from 0mA to 100mA is 12mV. Increasing the output capacitor's value and decreasing its ESR attenuates transient spikes. Input-Output (Dropout) Voltage A regulator's minimum input-output voltage differential (or dropout voltage) determines the lowest usable supply voltage. In battery-powered systems, this will determine the useful end-of-life battery voltage. Because the G913 use a P-channel MOSFET pass transistor, their dropout voltage is a function of RDS(ON) multiplied by the load current.
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Layout Guide An input capacitance of 1F is required between the G913 input pin and ground (the amount of the capacitance may be increased without limit), This capacitor must be located a distance of not more than 1cm from the input and return to a clean analog ground. Input capacitor can filter out the input voltage spike caused by the surge current due to the inductive effect of the package pin and the printed circuit board's routing wire. Otherwise, the actual voltage at the IN pin may exceed the absolute maximum rating.
G913
The output capacitor also must be located a distance of not more than 1cm from output to a clean analog ground. Because it can filter out the output spike caused by the surge current due to the inductive effect of the package pin and the printed circuit board's routing wire. Figure 6 is adjustable mode of G913 PCB layout. Figure 7 is a PCB layout of G913 fixed mode.
Figure 3. Recommended Minimum Footprint Safe Operating Area of G913 [Power Dissipation Limit]
200
Maximum Recommended Output Current
Maximum Power Dissipation of SOT-23-5
0.7 0.6 0.5 TA=25 Power Dissipation (W) 0.4 0.3 0.2 0.1 0
Still Air 1oz Copper on SOT-23-5 Package Mounted on recommend mimimum footprint (RJA=240C/W)
150 Output Current (mA)
100
TA=55 TA=85
50
TA=25C,Still Air 1oz Copper on SOT-23-5 Package Mounted on recommended mimimum footprint (RJA=240C/W)
Figure 4 Safe Operating Area
4.0 4.5
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
25
35
45
55
65
75
85
95
105
115
125
Input-Output Voltage Differential VIN-VOUT (V) Note : VIN(max) <=5.5V
Amibent Temperature TA (C)
Figure 4 Safe Operating Area
Figure 5 Power Dissipation vs. Temperature
Figure 6. Adjustable Mode
*Distance between pin & capacitor must no more than 1cm
Figure 7. Fixed Mode
*Distance between pin & capacitor must no more than 1cm
Ver 0.9 Preliminary Jan 25, 2002
TEL: 886-3-5788833 http://www.gmt.com.tw
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Global Mixed-mode Technology Inc.
Package Information
D C L
G913
E
H
e1 e
1
A A2 A1
b
Note: 1. Package body sizes exclude mold flash protrusions or gate burrs 2. Tolerance 0.1000 mm (4mil) unless otherwise specified 3. Coplanarity: 0.1000mm 4. Dimension L is measured in gage plane SYMBOLS
A A1 A2 b C D E e e1 H L 1
MIN
1.00 0.00 0.70 0.35 0.10 2.70 1.40 --------2.60 0.37 1
DIMENSIONS IN MILLIMETERS NOM
1.10 ----0.80 0.40 0.15 2.90 1.60 1.90(TYP) 0.95 2.80 -----5
MAX
1.30 0.10 0.90 0.50 0.25 3.10 1.80 --------3.00 ----9
Taping Specification
Feed Direction SOT23-5 Package Orientation
Ver 0.9 Preliminary Jan 25, 2002
TEL: 886-3-5788833 http://www.gmt.com.tw
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